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FICEP - GEMINI G32IT-LAS-FIC-2010-00001

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This FICEP GEMINI G32 plasma cutting machine was manufactured in 2010. It works with a spindle speed up to 7000 rpm. It counts with a plate size of 3100 x 6100 mm. This is a complete plate processor solution. It handles light to heavy plates for thermal cutting, marking, drilling, tapping, milling, and bevelling.

Overview

  • brand: FICEP
  • year: 2010
  • MODEL: GEMINI G32
  • application type: Cutting
  • Location: Italy
  • machine type: Plasma Cutting Machine

Technical Information - FICEP GEMINI G32

Dimensions

  • Machine Weight: 4800 kg

Additional Information

Machine Benefits

Technical Machine Benefits

  • Plate size: 3100 x 610 mm
  • Plate thickness with plasma: 80 mm
  • Plasma straight torches: 1
  • Plasm bevel torches: 1
  • Plate thickness with oxy: 100 mm
  • Oxy-fuel torches: 3
  • Drilling heads: 1
  • Drilling tools per head: 6
  • Drilling diameter: 40 mm
  • Drilling thickness: 80 mm

*There may be differences between the data shown and the actual values, this should be confirmed by the sales representative.

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Sergi Guardia

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Payment Terms

  • Payment in advance

  • Asset Financing

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